View UPC3210TB_144684.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

DATA SHEET
BIPOLAR ANALOG INTEGRATED CIRCUIT
PC3210TB
5 V, SUPER MINIMOLD SILICON MMIC WIDEBAND AMPLIFIER
DESCRIPTION
The PC3210TB is a silicon monolithic integrated circuits designed as wideband amplifier. The PC3210TB is suitable to systems required wideband operation from HF to L band. This IC is manufactured using NEC's 20 GHz fT NESATTMIII silicon bipolar process. This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
* High-density surface mounting: 6-pin super minimold package * Supply voltage * Wideband response * Power gain * Noise figure : VCC = 4.5 to 5.5 V : fu = 2.3 GHz TYP. @3 dB bandwidth : GP = 20 dB TYP. @f = 1.5 GHz : NF = 3.4 dB TYP. @f = 1.5 GHz
APPLICATION
* Systems required wideband operation from HF to 2.0 GHz
ORDERING INFORMATION
Part Number Package 6-pin super minimold Marking C2X Supplying Form Embossed tape 8 mm wide. 1, 2, 3 pins face to perforation side of the tape. Qty 3 kp/reel.
PC3210TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: PC3210TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for availability and additional information.
Document No. P13593EJ2V0DS00 (2nd edition) Date Published May 1999 N CP(K) Printed in Japan
The mark
shows major revised points.
(c)
1998, 1999
PC3210TB
PIN CONNECTIONS
(Top View) 3 (Bottom View) 4 4 3
Pin No. 1 2
Pin Name INPUT GND GND OUTPUT GND VCC
C2X
2
5
5
2
3 4
1
6
6
1
5 6
PRODUCT LINE-UP OF 5V-BIAS SILICON MMIC WIDEBAND AMPLIFIERS (TA = +25 C, VCC = 5.0 V, ZL = ZS = 50 )
fu (GHz) 2.9 PO (sat) (dBm) +1.0 GP (dB) 13 NF (dB) 5.0 @f = 1 GHz 4.5 @f = 1 GHz 3.2 @f = 0.5 GHz 5.5 @f = 0.5 GHz 3.5 @f = 0.5 GHz 3.4 @f = 1.5 GHz ICC (mA) 12
Part No.
Package 6-pin minimold 6-pin super minimold
Marking C1G
PC2711T PC2711TB PC2712T PC2712TB PC2713T PC2791TB PC2792TB PC3210TB
2.6
+3.0
20
12
6-pin minimold 6-pin super minimold
C1H
1.2
+7.0
29
12
6-pin minimold
C1J
1.9
+4.0
12
17
6-pin super minimold
C2S
1.2
+5.0
20
19
6-pin super minimold
C2T
2.3
+3.5
20
15
6-pin super minimold
C2X
Remark
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
Notice The package size distinguishes between minimold and super minimold.
2
Data Sheet P13593EJ2V0DS00
PC3210TB
PIN EXPLANATION
Applied Voltage V Pin Voltage Note V 0.82
Pin No. 1
Pin Name
Function and Applications
Internal Equivalent Circuit
INPUT
Signal input pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. A multifeedback circuit is designed to cancel the deviations of hFE and resistance. This pin must be coupled to signal source with capacitor for DC cut. Signal output pin. A internal matching circuit, configured with resistors, enables 50 connection over a wide band. This pin must be coupled to next stage with capacitor for DC cut. Power supply pin. This pin should be externally equipped with bypass capacitor to minimize ground impedance. Ground pin. This pin should be connected to system ground with minimum inductance. Ground pattern on the board should be formed as wide as possible. All the ground pins must be connected together with wide ground pattern to decrease impedance difference.
6 VCC 4 OUT
4
OUTPUT
4.0
1 IN
6
VCC
4.5 to 5.5
2 GND
5
3 GND
2 3 5
GND
0
Note Pin voltage is measured at VCC = 5.0 V
Data Sheet P13593EJ2V0DS00
3
PC3210TB
ABSOLUTE MAXIMUM RATINGS
Parameter Supply Voltage Circuit Current Total Power Dissipation Symbol VCC ICC PD TA = +25 C TA = +25 C Mounted on double sided copper clad 50 x 50 x 1.6 mm epoxy glass PWB (TA = +85 C) Conditions Ratings 6.0 30 200 Unit V mA mW
Operating Ambient Temperature Storage Temperature Input Power Level
TA Tstg Pin TA = +25 C
-40 to +85 -55 to +150 +10
C C dBm
RECOMMENDED OPERATING CONDITIONS
Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 4.5 -40 TYP. 5.0 +25 MAX. 5.5 +85 Unit V C
ELECTRICAL OPERATING CONDITIONS (TA = +25C, VCC = 5.0 V, ZS = ZL = 50 )
Parameter Circuit Current Power Gain Noise Figure Upper Limit Operating Frequency Isolation Input Return Loss Output Return Loss Maximum Output Level Gain Flatness Symbol ICC GP NF fu No signals f = 1.5 GHz f = 1.5 GHz 3 dB down below from gain at f = 0.1 GHz f = 1.5 GHz f = 1.5 GHz f = 1.5 GHz f = 1.5 GHz, Pin = 0 dBm f = 0.1 GHz to 2.05 GHz Test Conditions MIN. 11.5 18 - 2.05 TYP. 15.0 20 3.4 2.3 MAX. 19.5 - 4.4 - Unit mA dB dB GHz
ISL RLin RLout PO (sat) GP
29 10 7 +0.5 -
34 14.5 11 +3.5 1.0
- - - - -
dB dB dB dBm dB
4
Data Sheet P13593EJ2V0DS00
PC3210TB
TEST CIRCUIT
VCC 1 000 pF C4 1 000 pF C6
C3 1 000 pF 6 50 IN 1 000 pF C1 1
C5 1 000 pF 50 OUT 1 000 pF
4
C2
2, 3, 5
EXAMPLE OF APPLICATION CIRCUIT
VCC 1 000 pF C3 6 50 IN 1 000 pF C1 1 4 C7 1 000 pF C8 1 000 pF R1 50 to 200 2, 3, 5 To stabilize operation, please connect R1, C8 2, 3, 5 1 C4 1 000 pF 1 000 pF C5 1 000 pF C6 6 4 C2 1 000 pF 50 OUT
The application circuits and their parameters are for reference only and are not intended for use in actual design-ins.
Capacitors for VCC, input and output pins 1 000 pF capacitors are recommendable as bypass capacitor for VCC pin and coupling capacitors for input/output pins. Bypass capacitor for VCC pin is intended to minimize VCC pin's ground impedance. Therefore, stable bias can be supplied against VCC fluctuation. Coupling capacitors for input/output pins are intended to minimize RF serial impedance and cut DC. To get flat gain from 100 MHz up, 1 000 pF capacitors are assembled on the test circuit. [Actually, 1 000 pF capacitors give flat gain at least 10 MHz. In the case of under 10 MHz operation, increase the value of coupling capacitor such as 2 200 pF. Because the coupling capacitors are determined by the equation of C = 1/(2 fZs).]
Data Sheet P13593EJ2V0DS00
5
PC3210TB
ILLUSTRATION OF THE TEST CIRCUIT ASSEMBLED ON EVALUATION BOARD
Top View OUT C2X IN
C1 C3 C2
Mounting Direction
C4 C6 C5
COMPONENT LIST Notes
Value C1 to C6 1 000 pF
1. 2. 3. 4.
42 x 35 x 0.4 mm double sided copper clad polyimide board. Back side: GND pattern Solder plated on pattern : Through holes
6
Data Sheet P13593EJ2V0DS00
PC3210TB
TYPICAL CHARACTERISTICS (Unless otherwise specified, TA = +25 C)
CIRCUIT CURRENT vs. SUPPLY VOLTAGE 25 No input signal
Circuit Current ICC (mA)
CIRCUIT CURRENT vs. OPERATING AMBIENT TEMPERATURE 25 No input signal VCC = 5.5 V
Circuit Current ICC (mA)
20
20 VCC = 5.0 V 15 VCC = 4.5 V
15
10
10
5
5
0
0
1
2
3
4
5
6
0 - 60 - 40 - 20
0
+20 +40
+60 +80 +100
Supply Voltage VCC (V) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 7
Insertion Power Gain GP (dB)
Operating Ambient Temperature TA (C) NOISE FIGURE AND INSERTION POWER GAIN vs. FREQUENCY 7 25
Insertion Power Gain GP (dB)
25 VCC = 5.0 V VCC = 5.5 V
TA = - 40 C
TA = +25 C
VCC = 5.0 V
6
Noise Figure NF (dB)
20
Noise Figure NF (dB)
6 GP VCC = 4.5 V
20 GP TA = +85 C TA = +85 C TA = +25 C 5 NF TA = - 40 C 0.3 1.0 3.0 Frequency f (GHz) ISOLATION vs. FREQUENCY 0 VCC = 5.0 V
5
15
5
15
4
10 NF
VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V
4
10
3
5
3
2
0 0.1
0.3
1.0
3.0
2
0 0.1
Frequency f (GHz) ISOLATION vs. FREQUENCY 0 - 10
Isolation ISL (dB)
- 10
Isolation ISL (dB)
- 20 - 30 - 40 VCC = 4.5 V - 50 0.1 0.3 1.0 3.0 VCC = 5.5 V VCC = 5.0 V
- 20 - 30 - 40 - 50 0.1 TA = +85 C TA = +25 C
TA = - 40 C 0.3 1.0 3.0
Frequency f (GHz)
Frequency f (GHz)
Data Sheet P13593EJ2V0DS00
7
PC3210TB
INPUT RETURN LOSS vs. FREQUENCY 0 Input Return Loss RLin (dB) -5 - 10 - 15 VCC = 4.5 V - 20 - 25 0.1 Input Return Loss RLin (dB) VCC = 5.5 V VCC = 5.0 V 0 -5 - 10 TA = - 40 C - 15 - 20 - 25 0.1 INPUT RETURN LOSS vs. FREQUENCY VCC = 5.0 V TA = +85 C TA = +25 C
0.3
1.0
3.0
0.3
1.0
3.0
Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY 0 Output Return Loss RLout (dB) -5 VCC = 5.5 V - 10 - 15 - 20 - 25 0.1 VCC = 5.0 V Output Return Loss RLout (dB) 0
Frequency f (GHz) OUTPUT RETURN LOSS vs. FREQUENCY VCC = 5.0 V -5 TA = +25 C - 10 - 15 TA = +85 C - 20 - 25 0.1 TA = - 40 C
VCC = 4.5 V
0.3
1.0
3.0
0.3
1.0
3.0
Frequency f (GHz) OUTPUT POWER vs. INPUT POWER +10 +5 Output Power Pout (dBm) 0 -5 - 10 - 15 - 20 - 25 - 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 +5 +10 VCC = 4.5 V f = 1.0 GHz +10 VCC = 5.5 V Output Power Pout (dBm) VCC = 5.0 V
Frequency f (GHz) OUTPUT POWER vs. INPUT POWER f = 1.0 GHz +5 VCC = 5.0 V 0 -5 - 10 - 15 - 20 - 25 - 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) 0 +5 +10 TA = +85 C TA = +25 C TA = - 40 C
8
Data Sheet P13593EJ2V0DS00
PC3210TB
OUTPUT POWER vs. INPUT POWER +10 +5
Output Power Pout (dBm)
OUTPUT POWER vs. INPUT POWER +10 f = 1.5 GHz +5 VCC = 5.0 V 0 -5 - 10 - 15 - 20 - 25 TA = +85 C TA = - 40 C TA = +25 C
f = 1.5 GHz
VCC = 5.5 V
Output Power Pout (dBm)
0 -5 - 10 - 15 - 20 - 25 - 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) OUTPUT POWER vs. INPUT POWER +10 +5 0 +5 +10 VCC = 5.0 V VCC = 4.5 V
- 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm)
0
+5 +10
OUTPUT POWER vs. INPUT POWER +10 f = 2.0 GHz +5 VCC = 5.0 V 0 -5 - 10 - 15 - 20 - 25 TA = +85 C TA = - 40 C TA = +25 C
f = 2.0 GHz
VCC = 5.5 V
Output Power Pout (dBm)
Output Power Pout (dBm)
0 -5 - 10 - 15 - 20 - 25 - 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm) SATURATED OUTPUT POWER vs. FREQUENCY 0 +5 +10 VCC = 5.0 V VCC = 4.5 V
- 30 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power Pin (dBm)
0
+5 +10
SATURATED OUTPUT POWER vs. FREQUENCY
Saturated Output Power PO (sat) (dBm)
Saturated Output Power PO (sat) (dBm)
+10 VCC = 5.5 V +5 VCC = 4.5 V 0 VCC = 5.0 V Pin = 0 dBm
+10
TA = +85 C
VCC = 5.0 V Pin = 0 dBm
+5 TA = - 40 C 0 TA = +25 C
-5
-5
- 10 0.1
0.3
1.0
3.0
- 10 0.1
0.3
1.0
3.0
Frequency f (GHz)
Frequency f (GHz)
Data Sheet P13593EJ2V0DS00
9
PC3210TB
THIRD ORDER INTERMODULATION DISTORTION AND OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +10 f1 = 1 000 MHz VCC = 5.5 V Pout (each) f2 = 1 002 MHz 0 VCC = 5.0 V - 10 - 20 - 30 - 40 - 50 - 60 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power of Each Tone Pin (each) (dBm) THIRD ORDER INTERMODULATION DISTORTION AND OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +10 f1 = 1 500 MHz VCC = 5.5 V Pout (each) f2 = 1 502 MHz 0 - 10 - 20 - 30 - 40 - 50 - 60 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power of Each Tone Pin (each) (dBm) THIRD ORDER INTERMODULATION DISTORTION AND OUTPUT POWER OF EACH TONE vs. INPUT POWER OF EACH TONE +10 f1 = 2 000 MHz Pout (each) VCC = 5.5 V f2 = 2 002 MHz 0 - 10 - 20 - 30 - 40 - 50 IM3 VCC = 4.5 V 0 VCC = 4.5 V VCC = 5.0 V 0 IM3 VCC = 4.5 V VCC = 5.0 V 0 IM3 VCC = 4.5 V VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE - 50 f1 = 1 000 MHz - 45 f2 = 1 002 MHz VCC = 5.5 V - 40 - 35 - 30 - 25 - 20 - 15 - 10 -5 0 - 20 - 15 - 10 -5 0 VCC = 4.5 V VCC = 5.0 V
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout (each) (dBm)
3rd Order Intermodulation Distortion IM3 (dBc)
Output Power of Each Tone Pout (each) (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE - 50 f1 = 1 500 MHz - 45 f2 = 1 502 MHz VCC = 5.5 V - 40 VCC = 5.0 V - 35 - 30 - 25 - 20 - 15 - 10 -5 0 - 20 - 15 - 10 -5 0 VCC = 4.5 V
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout (each) (dBm)
VCC = 5.5 V VCC = 5.0 V VCC = 4.5 V
3rd Order Intermodulation Distortion IM3 (dBc)
Output Power of Each Tone Pout (each) (dBm) THIRD ORDER INTERMODULATION DISTORTION vs. OUTPUT POWER OF EACH TONE - 50 f1 = 2 000 MHz - 45 f2 = 2 002 MHz - 40 - 35 - 30 - 25 - 20 - 15 - 10 -5 0 - 20 - 15 VCC = 5.0 V VCC = 4.5 V - 10 -5 0 VCC = 5.5 V
3rd Order Intermodulation Distortion IM3 (dBm) Output Power of Each Tone Pout (each) (dBm)
VCC = 5.5 V VCC = 5.0 V
- 60 - 40 - 35 - 30 - 25 - 20 - 15 - 10 - 5 Input Power of Each Tone Pin (each) (dBm)
3rd Order Intermodulation Distortion IM3 (dBc)
Output Power of Each Tone Pout (each) (dBm)
10
Data Sheet P13593EJ2V0DS00
PC3210TB
S-PARAMETER (VCC = 5.0 V)
S11-FREQUENCY -
1G 0.1 G 2.0 G
S22-FREQUENCY -
0.1 G
2.0 G
1.0 G
Data Sheet P13593EJ2V0DS00
11
PC3210TB
TYPICAL S-PARAMETER VALUES (TA = +25 C)
PC3210TB
VCC = 5.0 V, ICC = 16 mA
FREQUENCY MHz 100.0000 200.0000 300.0000 400.0000 500.0000 600.0000 700.0000 800.0000 900.0000 1000.0000 1100.0000 1200.0000 1300.0000 1400.0000 1500.0000 1600.0000 1700.0000 1800.0000 1900.0000 2000.0000 2100.0000 2200.0000 2300.0000 2400.0000 2500.0000 2600.0000 2700.0000 2800.0000 2900.0000 3000.0000 3100.0000 S11 MAG. 0.358 0.335 0.321 0.306 0.294 0.283 0.273 0.267 0.260 0.252 0.246 0.239 0.229 0.224 0.215 0.203 0.191 0.179 0.163 0.155 0.140 0.133 0.130 0.133 0.137 0.149 0.157 0.170 0.181 0.203 0.209 ANG. 171.9 166.6 160.7 158.3 154.4 151.8 148.6 146.0 144.2 141.5 138.4 135.9 133.3 131.1 127.4 125.8 123.1 122.1 121.0 123.4 126.1 129.1 135.3 139.0 144.0 148.5 150.2 152.2 150.3 149.0 147.9 MAG. 8.688 8.807 8.821 8.841 8.908 8.990 9.160 9.342 9.541 9.741 10.071 10.393 10.513 10.763 10.708 10.720 10.388 9.993 9.507 8.983 8.384 7.905 7.412 6.976 6.582 6.202 5.942 5.567 5.360 5.013 4.810 S21 ANG. -4.4 -10.6 -17.1 -23.3 -29.2 -35.1 -41.0 -47.3 -53.9 -60.8 -68.6 -76.3 -85.4 -94.5 -104.0 -114.2 -124.1 -133.7 -142.8 -151.2 -158.9 -166.0 -172.3 -178.6 176.1 170.4 164.9 159.7 153.9 149.0 142.9 MAG. 0.019 0.019 0.019 0.019 0.019 0.019 0.019 0.018 0.018 0.019 0.019 0.018 0.019 0.019 0.021 0.021 0.023 0.023 0.025 0.024 0.027 0.029 0.032 0.034 0.038 0.039 0.043 0.045 0.047 0.048 0.051 S12 ANG. -1.4 3.3 6.3 9.9 13.6 15.8 19.5 24.3 29.8 28.9 29.4 36.7 38.1 45.6 48.2 48.9 55.7 59.5 61.9 65.9 69.0 70.7 71.8 74.3 73.2 71.4 73.7 72.2 72.5 69.6 71.0 MAG. 0.233 0.237 0.233 0.233 0.241 0.246 0.250 0.256 0.263 0.274 0.283 0.291 0.299 0.303 0.311 0.316 0.308 0.303 0.291 0.275 0.255 0.230 0.207 0.182 0.157 0.136 0.116 0.102 0.099 0.104 0.117 S22 ANG. -6.8 -12.0 -15.1 -20.6 -25.6 -30.8 -35.8 -41.2 -47.9 -53.1 -59.0 -65.7 -71.9 -79.7 -87.6 -94.9 -103.4 -111.5 -119.5 -128.4 -135.0 -140.5 -145.9 -150.3 -151.8 -152.1 -147.1 -137.8 -132.3 -122.3 -114.4 2.63 2.71 2.68 2.68 2.67 2.74 2.67 2.65 2.69 2.46 2.37 2.38 2.25 2.20 2.05 2.07 1.98 2.02 2.01 2.17 2.14 2.12 2.10 2.12 2.06 2.13 2.03 2.04 2.03 2.10 2.08 K
12
Data Sheet P13593EJ2V0DS00
PC3210TB
PACKAGE DIMENSIONS
6 pin super minimold (unit: mm)
0.2 +0.1 -0
0.1 MIN.
0.15 +0.1 -0
1.25 0.1
2.1 0.1
0 to 0.1
0.65 1.3
0.65
0.7 0.9 0.1
2.0 0.2
Data Sheet P13593EJ2V0DS00
13
PC3210TB
NOTES ON CORRECT USE
(1) Observe precautions for handling because of electro-static sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). All the ground pins must be connected together with wide ground pattern to decrease impedance difference. (3) The bypass capacitor should be attached to VCC line. (4) The DC cut capacitor must be each attached to input and output pin.
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered in the following recommended conditions. Other soldering methods and conditions than the recommended conditions are to be consulted with our sales representatives.
PC3210TB
Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235 C or below Time: 30 seconds or less (at 210 C) Note Count: 3, Exposure limit : None Package peak temperature: 215 C or below Time: 40 seconds or less (at 200 C) Note Count: 3, Exposure limit : None Soldering bath temperature: 260 C or below Time: 10 seconds or less Note Count: 1, Exposure limit : None Pin temperature: 300 C Time: 3 seconds or less (per side of device) Note Exposure limit : None Recommended Condition Symbol IR35-00-3
VPS
VP15-00-3
Wave Soldering
WS60-00-1
Partial Heating
-
Note After opening the dry pack, keep it in a place below 25 C and 65 % RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating).
For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E).
14
Data Sheet P13593EJ2V0DS00
PC3210TB
[MEMO]
Data Sheet P13593EJ2V0DS00
15
PC3210TB
ATTENTION
OBSERVE PRECAUTIONS FOR HANDLING
ELECTROSTATIC SENSITIVE DEVICES
NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation.
* The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. * No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in this document. * NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property rights of third parties by or arising from use of a device described herein or any other liability arising from use of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other intellectual property rights of NEC Corporation or others. * Descriptions of circuits, software, and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples. The incorporation of these circuits, software, and information in the design of the customer's equipment shall be done under the full responsibility of the customer. NEC Corporation assumes no responsibility for any losses incurred by the customer or third parties arising from the use of these circuits, software, and information. * While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices, the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety measures in its design, such as redundancy, fire-containment, and anti-failure features. * NEC devices are classified into the following three quality grades: "Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a customer designated "quality assurance program" for a specific application. The recommended applications of a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device before using it in a particular application. Standard: Computers, office equipment, communications equipment, test and measurement equipment, audio and visual equipment, home electronic appliances, machine tools, personal electronic equipment and industrial robots Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster systems, anti-crime systems, safety equipment and medical equipment (not specifically designed for life support) Specific: Aircraft, aerospace equipment, submersible repeaters, nuclear reactor control systems, life support systems or medical equipment for life support, etc. The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books. If customers intend to use NEC devices for applications other than those specified for Standard quality grade, they should contact an NEC sales representative in advance.
M7 98. 8

▲Up To Search▲

Price & Availability of UPC3210TB

	To Download UPC3210TB Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .